THREE DIMENSIONAL (3D) FAN-OUT PACKAGING MECHANISMS

摘要

The mechanisms of forming a semiconductor device package provides a manufacturing process at low costs due to relative simple process flow. The warpage of the total package is greatly reduced by forming an interconnection structure having a redistribution layer(s) to bond at least one die to the lower part of a package structure. In addition, the interconnection structure is formed without using a molding compound, which reduces particle contamination. The reduction of the warpage and the particle contamination improves yield. Moreover, a semiconductor package formed, under a pace between a space between the package structure and the interconnection structure, has low form factor having the at least one die fit.