| 摘要 |
The present invention provides a polishing composition capable of adequately limiting dishing phenomena in polishing steps and of more reliably eliminating level differences. The present invention is a polishing composition: which contains silica on the surface of which an organic acid has been fixed and a polyoxyalkylene group-containing compound; for which the molecular weight distribution of the weight average molecular weight (calculated as polyethylene glycol) of the polyoxyalkylene group-containing compound by gel permeation chromatography (GPC) has at least two peaks; and for which the pH is not more than 7. |
