| 发明名称 | Thermal head, printer, and method of manufacturing thermal head | ||
| 摘要 | A thermal head has a support substrate, an upper substrate arranged on the support substrate on one surface side thereof in a laminated state, and an intermediate layer arranged between the upper substrate and the support substrate to bond the upper substrate and the support substrate to each other. The intermediate layer has one of a through hole and a concave portion forming a cavity portion between the upper substrate and the support substrate. A heat generating resistor is formed on a surface of the upper substrate on a side opposite to the support substrate at a position opposed to the cavity portion. The intermediate layer is formed of a glass paste having a melting point lower than a firing temperature of the support substrate and higher than a melting temperature of the upper substrate. | ||
| 申请公布号 | US9302495(B2) | 申请公布日期 | 2016.04.05 |
| 申请号 | US201313898823 | 申请日期 | 2013.05.21 |
| 申请人 | SEIKO INSTRUMENTS INC. | 发明人 | Sanbongi Norimitsu;Koroishi Keitaro;Morooka Toshimitsu |
| 分类号 | B41J2/15;B41J2/335;H01C17/00 | 主分类号 | B41J2/15 |
| 代理机构 | Adams & Wilks | 代理人 | Adams & Wilks |
| 主权项 | 1. A thermal head comprising: a support substrate; an upper substrate arranged on the support substrate on one surface side thereof in a laminated state; an intermediate layer which is arranged between the upper substrate and the support substrate to bond the upper substrate and the support substrate to each other, and which has one of a through hole and a concave portion to form a cavity portion between the upper substrate and the support substrate; and a heat generating resistor formed on a surface of the upper substrate on a side opposite to the support substrate at a position opposed to the cavity portion, wherein the intermediate layer is formed of a glass paste having a melting point lower than a firing temperature of the support substrate and higher than a melting temperature of the upper substrate. | ||
| 地址 | JP | ||