发明名称 PROCESSING METHOD OF SUBSTRATE, PROCESSED SUBSTRATE, MANUFACTURING METHOD OF ELECTRONIC COMPONENT, ELECTRONIC COMPONENT, ELECTRONIC APPARATUS AND MOVABLE BODY
摘要 PROBLEM TO BE SOLVED: To provide a processing method of a substrate effectively preventing an unnecessary deposit from remaining on the substrate subsequent to dry etching while stably fixing the substrate at the time of dry etching, and further to provide a processed substrate having a desired pattern and preventing an unintended deposit from remaining.SOLUTION: A processing method of a substrate includes: a step 1a of fixing a substrate 1 being coated with a mask 4 with a predetermined pattern via a metal film 2 on a support member 3 and being constituted of an inorganic material; a dry etching step 1b of fixing the support member 3 to a stage 5 of a dry etching device and applying dry etching thereto in a state of the substrate 1 being supported by the support member 3 via the metal film 2; and a separating step 1c of dissolving a metallic material constituting the metal film 2 and separating the substrate 1 applied with the dry etching from the support member 3.SELECTED DRAWING: Figure 1
申请公布号 JP2016046713(A) 申请公布日期 2016.04.04
申请号 JP20140170491 申请日期 2014.08.25
申请人 SEIKO EPSON CORP 发明人 FUNEKAWA TAKEO
分类号 H03H3/02;H03H9/19;H03H9/215 主分类号 H03H3/02
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