发明名称 |
PROCESSING METHOD OF SUBSTRATE, PROCESSED SUBSTRATE, MANUFACTURING METHOD OF ELECTRONIC COMPONENT, ELECTRONIC COMPONENT, ELECTRONIC APPARATUS AND MOVABLE BODY |
摘要 |
PROBLEM TO BE SOLVED: To provide a processing method of a substrate effectively preventing an unnecessary deposit from remaining on the substrate subsequent to dry etching while stably fixing the substrate at the time of dry etching, and further to provide a processed substrate having a desired pattern and preventing an unintended deposit from remaining.SOLUTION: A processing method of a substrate includes: a step 1a of fixing a substrate 1 being coated with a mask 4 with a predetermined pattern via a metal film 2 on a support member 3 and being constituted of an inorganic material; a dry etching step 1b of fixing the support member 3 to a stage 5 of a dry etching device and applying dry etching thereto in a state of the substrate 1 being supported by the support member 3 via the metal film 2; and a separating step 1c of dissolving a metallic material constituting the metal film 2 and separating the substrate 1 applied with the dry etching from the support member 3.SELECTED DRAWING: Figure 1 |
申请公布号 |
JP2016046713(A) |
申请公布日期 |
2016.04.04 |
申请号 |
JP20140170491 |
申请日期 |
2014.08.25 |
申请人 |
SEIKO EPSON CORP |
发明人 |
FUNEKAWA TAKEO |
分类号 |
H03H3/02;H03H9/19;H03H9/215 |
主分类号 |
H03H3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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