发明名称 |
BREAK METHOD FOR COMPOSITE SUBSTRATE AND BREAK DEVICE THEREFOR |
摘要 |
PROBLEM TO BE SOLVED: To provide a break method capable of efficiently surely breaking a composite substrate in such a state that there is no remaining unbroken portion, and to provide a break device therefor.SOLUTION: There is provided a break method for a composite substrate W in which a resin layer 3 is formed on one side of a substrate body 1 comprising a brittle material via an adhesive layer 2 and plural rows of scribe line S are formed on the surface of the substrate body 1. The method comprises: a first break process of pressing the blade tip of a break bar 8 into a resin layer 3 and the adhesive layer 2 while cutting into by sticking the composite substrate W to an adhesive tape 5 placing the substrate body 1 at a lower side and by pressing the break bar 8 to the scribe line S from the upper face of the resin layer 3 and bowing down the substrate body 1 below to break the substrate body 1 along the scribe line S: and a second break process of bowing down again the broken line L broken in the first break process to break a remaining unbroken portion by placing the adhesive tape 5 on an upper side and press-rolling a roller 13 on overall width of the upper face of the composite substrate W.SELECTED DRAWING: Figure 4 |
申请公布号 |
JP2016043688(A) |
申请公布日期 |
2016.04.04 |
申请号 |
JP20150068496 |
申请日期 |
2015.03.30 |
申请人 |
MITSUBOSHI DIAMOND INDUSTRIAL CO LTD |
发明人 |
TAMURA KENTA;TAKEDA MASAKAZU;MURAKAMI KENJI;TOKUMO HIROSHI |
分类号 |
B28D5/00;C03B33/033 |
主分类号 |
B28D5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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