发明名称 半導体発光装置の製造方法
摘要 <P>PROBLEM TO BE SOLVED: To provide an efficient manufacturing method with which, in manufacturing a semiconductor light-emitting apparatus obtained by sealing a semiconductor light-emitting element with a sealing material containing phosphor, a blend composition of the sealing material is easily changed and a high distribution property of the phosphor can be maintained. <P>SOLUTION: A method of manufacturing a semiconductor light-emitting apparatus includes a mounting step for mounting a semiconductor light-emitting element 2 on a surface of a circuit board 1, a sealing agent supplying step for placing a phosphor-containing resin composition 5 that is liquid having a viscosity of 500 Pa sec or more at normal temperature or solid or semi-solid at normal temperature and includes a phosphor 6 for converting a wavelength of light emitted by the semiconductor light-emitting element 2, on the surface of the circuit board where the semiconductor light-emitting element 2 is mounted, and a compression-molding step for compression-molding the phosphor-containing resin composition 5 to seal the semiconductor light-emitting element 2, thereby forming a seal. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP5894723(B2) 申请公布日期 2016.03.30
申请号 JP20090299188 申请日期 2009.12.29
申请人 株式会社朝日ラバー 发明人 我妻 優;田崎 益次;小田喜 勉
分类号 H01L33/50 主分类号 H01L33/50
代理机构 代理人
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