发明名称 INDUCTOR ARRAY CHIP AND BOARD FOR MOUNTING THE SAME
摘要 Provided are an inductor array chip and a board having the same. The inductor array chip comprises: a body in which a plurality of magnetic layers are stacked; first and second coil parts having a plurality of conductive patterns and a plurality of conductive vias formed in the plurality of magnetic layers; and first to fourth external electrodes disposed on outer surfaces of the body to be connected to both ends of the first and second coil parts, respectively, wherein the first and second coil parts are disposed in the thickness direction of the body and are separated from each other by a gap layer disposed therebetween.
申请公布号 KR20160032581(A) 申请公布日期 2016.03.24
申请号 KR20140122896 申请日期 2014.09.16
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 SON, SOO HWAN;CHOI, YU JIN;KIM, HO YOON
分类号 H01F17/00;H01F27/28;H05K1/18 主分类号 H01F17/00
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