发明名称 MOVABLE GAS NOZZLE IN DRYING MODULE
摘要 Provided herein are methods and apparatuses for cleaning wafers by coating an active surface of the wafer with a film of water to clean the wafer, delivering gas from a gas nozzle to the center of the active surface to break a film of water on the active surface to form a wet-dry boundary while spinning the wafer, and moving the gas nozzle radially outward from the center to the edge of the active surface of the wafer by following the wet-dry boundary. Tracking devices, such as cameras or charge-coupled devices, and systems may be used with an apparatus for cleaning wafers by tracking the wet-dry boundary on the wafer to move the gas nozzle to follow the wet-dry boundary. Cleaning apparatuses provided herein may be integrated with etching tools.
申请公布号 US2016086864(A1) 申请公布日期 2016.03.24
申请号 US201414495693 申请日期 2014.09.24
申请人 Lam Research Corporation 发明人 Fischer Andreas;Lill Thorsten;Trussell David
分类号 H01L21/66;H01L21/67;H01L21/02 主分类号 H01L21/66
代理机构 代理人
主权项 1. A method of cleaning wafers, the method comprising: coating an active surface of the wafer with a film of water to clean the wafer, delivering gas from a gas nozzle to the center of the active surface to break a film of water on the active surface to form a wet-dry boundary while spinning the wafer, and when the film of water is broken, moving the gas nozzle radially outward from the center to the edge of the active surface of the wafer by following the wet-dry boundary.
地址 Fremont CA US