SOLDER BUMP STRETCHING METHOD FOR FORMING A SOLDER BUMP JOINT IN A DEVICE

摘要

The present invention provides a solder bump drawing method for forming a solder bump joint in a device. The method includes a step of heating a solder bump at a temperature higher than a melting temperature of the solder bump. The solder bump is drawn to increase a height of the solder bump. The solder bump is cooled to form a solder bump joint in an electronic device. According to the present invention, a package comprises: a substrate having an upper surface and a lower surface; a die having an upper surface and a lower surface, wherein the lower surface of the die faces the upper surface of the die; and the solder bump electrically connected to the upper surface of the substrate and the lower surface of the die.