Stacked packaging using reconstituted wafers

摘要

An exemplary implementation of the present disclosure includes a stacked package having a top die from a top reconstituted wafer situated over a bottom die from a bottom reconstituted wafer. The top die and the bottom die are insulated from one another by an insulation arrangement. The top die and the bottom die are also interconnected through the insulation arrangement. The insulation arrangement can include a top molding compound that flanks the top die and a bottom molding compound that flanks the bottom die. The top die and the bottom die can be interconnected through at least the top molding compound. Furthermore, the top die and the bottom die can be interconnected through a conductive via that extends within the insulation arrangement.

主权项

1. A wafer stack, comprising:
a bottom die; a top die situated over the bottom die; a bottom molding compound that flanks the bottom die; a top molding compound that flanks the top die; a first passivation structure in contact with the bottom die, bottom molding compound, top die, and top molding compound, wherein the first passivation structure comprises:
a first passivation layer in contact with the bottom die and the bottom molding compound, anda second passivation layer in contact with the top die, top molding compound, and first passivation layer, and a conductive via extending through at least a portion of the bottom molding compound, top molding compound, and the first passivation structure, wherein the top die and the bottom die are concurrently singulatable from the wafer stack.