发明名称 MULTI-PHASED MEMS PLATE LOWERING AND LIFTING SYSTEM AND METHOD
摘要 A MEMS device includes a bottom plate structure supporting a conductive electrode. A flexible conductive top plate movably supported by a flexure is affixed to a small peripheral portion of the top plate that is aligned with the electrode. Drive circuitry applies a high level of a drive voltage signal between the electrode and the top plate to produce an attracting electrostatic force between the top plate and the electrode sufficient to overcome the flexure and draw the top plate against the electrode. The drive circuitry later applies a low level of the drive voltage signal to remove the electrostatic force and allow the flexure to peel the peripheral portion away from the electrode. Additional drive voltage signals may be applied to additional electrodes to draw additional peripheral portions of the top plate against the additional electrodes and successively removed to allow peripheral portions of the top plate to be sequentially peeled away from the electrodes.
申请公布号 US2016075548(A1) 申请公布日期 2016.03.17
申请号 US201414488616 申请日期 2014.09.17
申请人 Texas Instruments Incorporated 发明人 Barker Paul G.
分类号 B81B3/00;H01G5/16;H01L41/04 主分类号 B81B3/00
代理机构 代理人
主权项 1. A MEMS (micro-electromechanical system) device comprising: (a) a bottom plate structure supporting a conductive first electrode; (b) a flexible conductive top plate supported by a first spring structure affixed to a relatively small first peripheral portion of the top plate that is generally aligned with the first electrode; and (c) electrode drive circuitry for applying a relatively high level of a first drive voltage signal between the first electrode and the top plate to produce an attractive electrostatic force between the top plate and the first electrode sufficient to flex the spring structure and draw the top plate against the first electrode and for later applying a relatively low level of the first drive voltage signal to remove the attractive electrostatic force and allow the first spring structure to peel the first peripheral portion away from the first electrode.
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