| 发明名称 |
SEMICONDUCTOR DEVICE HAVING TERMINALS FORMED ON A CHIP PACKAGE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS AND MANUFACTURING METHOD THEREOF |
| 摘要 |
A semiconductor device includes a chip package including plurality of stacked semiconductor chips, a sealing layer covering at least an upper surface of the chip package, a plurality of first conductive elements disposed on the chip package and exposed on an upper surface of the sealing layer, and a plurality of second conductive elements, each being disposed on one of the exposed surfaces of the first conductive elements. |
| 申请公布号 |
US2016079222(A1) |
申请公布日期 |
2016.03.17 |
| 申请号 |
US201514842630 |
申请日期 |
2015.09.01 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
SATO Takao |
| 分类号 |
H01L25/18;H01L21/56;H01L25/00;H01L23/00;H01L23/31;H01L25/065 |
主分类号 |
H01L25/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device comprising:
a chip package including plurality of stacked semiconductor chips; a sealing layer covering at least an upper surface of the chip package; a plurality of first conductive elements disposed on the chip package and exposed on an upper surface of the sealing layer; and a plurality of second conductive elements, each being disposed on one of the exposed surfaces of the first conductive elements. |
| 地址 |
Tokyo JP |
