发明名称 |
Luminous devices, packages and systems containing the same, and fabricating methods thereof |
摘要 |
The present invention is directed to a vertical-type luminous device and high throughput methods of manufacturing the luminous device. These luminous devices can be utilized in a variety of luminous packages, which can be placed in luminous systems. The luminous devices are designed to maximize light emitting efficiency and/or thermal dissipation. Other improvements include an embedded zener diode to protect against harmful reverse bias voltages. |
申请公布号 |
US9287479(B2) |
申请公布日期 |
2016.03.15 |
申请号 |
US201414582413 |
申请日期 |
2014.12.24 |
申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
Kim Yu-Sik |
分类号 |
H01L27/15;H01L31/12;H01L33/00;H01L33/62 |
主分类号 |
H01L27/15 |
代理机构 |
Onello & Mello, LLP |
代理人 |
Onello & Mello, LLP |
主权项 |
1. A light emitting device, comprising:
a supporting member having a first conductive member and a second conductive member, wherein each of the first conductive member and the second conductive member extends from a first surface of the supporting member to a second surface of the supporting member opposite the first surface; and a luminous structure connected onto the first surface of the supporting member, the luminous structure having a first cladding layer, an active layer and a second cladding layer, and an insulated through-via contact connected to the first conductive member. |
地址 |
KR |