Paste transfer unit, electronic component mounting device, and transferred film thickness measuring method

摘要

To measure a film thickness of a coating film (25a) of a flux (25) serving as a bonding paste formed on a transfer stage (24) of a paste transfer unit (7), the film thickness of the coating film (25a) in a transfer area (26) is measured through a light-transmitting member (51) by a light interference method and by an optical type film thickness measuring sensor (53) which is arranged below the transfer stage (24). Thus, it is possible to automatically and accurately measure the film thickness of the flux (25) in the transfer area (26) without requiring any complicated measurement work.

主权项

1. A paste transfer unit which is used for transferring a light-transmissible bonding paste to a solder bump in an electronic component mounting device which mounts, on a substrate, an electronic component having a lower surface on which the solder bump is formed, the paste transfer unit comprising:
a transfer stage to which the bonding paste is supplied and in which at least a part of a transfer area is made of a light-transmitting member, the transfer area being configured to transfer the bonding paste as a result of solder bump moving; a squeegee which is arranged above the transfer stage to have a predetermined film-formation-gap from a coating film formation surface on the transfer stage and which moves relatively and horizontally to the transfer stage to thereby form the supplied bonding paste into a coating film with a predetermined film thickness; and an optical type film thickness measuring sensor which is arranged below the transfer stage and which measures the film thickness of the coating film in the transfer area through the light-transmitting member.