| 摘要 |
The present invention relates to a substrate treating device. According to an embodiment of the present invention, the substrate treating device comprises: a support unit configured to support a substrate; a container configured to collect chemical liquid while surrounding the support unit; a chemical liquid supply unit configured to supply the chemical liquid to the substrate; and a pre-dispense unit which is located on an external side of the container and through which the chemical liquid is preliminarily discharged before the chemical liquid supply unit supplies the chemical liquid to an upper portion of the substrate. The pre-dispense unit comprises: a housing having an internal space and having a hole formed in an upper portion thereof; a scattering preventing plate provided into the housing and having a hole formed therein; and a drain line connected to a lower area of the scattering preventing plate in the internal space and configured to drain the chemical liquid discharged to the internal space. The chemical liquid supply unit is inserted into the hole formed in the housing and the hole formed in the scattering preventing plate. |
