LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

The present invention relates to a light emitting diode package and a manufacturing method thereof. The light emitting diode package according to an embodiment of the present invention comprises: a housing; at least one light emitting diode chip disposed in the housing; a first phosphor excited by the at least one light emitting chip to emit green light; a second phosphor and a third phosphor excited by the at least one light emitting diode chip to emit red light, wherein the second phosphor is a phosphor having a chemical formula of A_2MF_6 : Mn^4+, the A is one of Li, Na, K, Ba, Rb, Cs, Mg, Ca, Se and Zn, the M is one of Ti, Si, Zr, Sn and Ge, the third phosphor is a nitride phosphor, the red lights from the second phosphor and the third phosphor have different peak wavelengths, and the third phosphor has 0.1 to 10 wt% mass range with respect to the second phosphor. According to the present invention, the reliability of the light emitting diode package can be improved since the reliability of the phosphor contained in the light emitting diode package is improved. Therefore, the retention time of optical light emitted by the light emitting diode package can be extended and the change in the CIE color coordinate can be minimized.