| 摘要 |
The present invention relates to a press heater with a silicon carbide heater for NCP flip chip bonding equipment. The heater comprises: a lower plate (100) installed at a press operating location of flip chip bonding equipment; a base (200) fixed and coupled to an upper surface of the lower plate (100); a silicon carbide heater (300) configured to generate heat at high temperatures if electricity is supplied; and a terminal coupling body (400) configured to mutually and electrically connect a line (L) with the silicon carbide heater. Therefore, the heater prevents a connection portion of the silicon carbide heater and the line from being damaged and disconnected at high temperatures. |
