发明名称 ELECTRONIC COMPONENT HOUSING CONTAINER, ELECTRONIC DEVICE, METHOD OF MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC APPARATUS AND MOBILE
摘要 PROBLEM TO BE SOLVED: To provide an electronic component housing container in which deairing and sealing of a housing space for housing an electronic component can be facilitated.SOLUTION: In an electronic component housing container including a base, a bonding material for bonding a lid to the base, where the base and lid are bonded via the bonding material to form a housing space for housing the electronic component, the bonding material includes one surface to be bonded to the base, and the other surface to which the lid is bonded. A groove interconnecting the housing space and the outside is provided in one surface, and a region of one surface excepting at least the region of the groove is bonded to the base.SELECTED DRAWING: Figure 2
申请公布号 JP2016032058(A) 申请公布日期 2016.03.07
申请号 JP20140154615 申请日期 2014.07.30
申请人 SEIKO EPSON CORP 发明人 AOKI SHINYA;KIKUCHI TAKAYUKI
分类号 H01L23/02;G01C19/5628;H01L41/053;H01L41/113;H01L41/23;H03H3/02;H03H9/02 主分类号 H01L23/02
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