发明名称 |
ELECTRONIC COMPONENT HOUSING CONTAINER, ELECTRONIC DEVICE, METHOD OF MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC APPARATUS AND MOBILE |
摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component housing container in which deairing and sealing of a housing space for housing an electronic component can be facilitated.SOLUTION: In an electronic component housing container including a base, a bonding material for bonding a lid to the base, where the base and lid are bonded via the bonding material to form a housing space for housing the electronic component, the bonding material includes one surface to be bonded to the base, and the other surface to which the lid is bonded. A groove interconnecting the housing space and the outside is provided in one surface, and a region of one surface excepting at least the region of the groove is bonded to the base.SELECTED DRAWING: Figure 2 |
申请公布号 |
JP2016032058(A) |
申请公布日期 |
2016.03.07 |
申请号 |
JP20140154615 |
申请日期 |
2014.07.30 |
申请人 |
SEIKO EPSON CORP |
发明人 |
AOKI SHINYA;KIKUCHI TAKAYUKI |
分类号 |
H01L23/02;G01C19/5628;H01L41/053;H01L41/113;H01L41/23;H03H3/02;H03H9/02 |
主分类号 |
H01L23/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|