| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor laser device having high yield and long life by improving the mounting strength. <P>SOLUTION: This semiconductor laser device includes: a semiconductor laser chip 100 made of a nitride-based compound semiconductor; a heat sink 200 on which the semiconductor laser chip 100 is mounted; and a stem 300 which supports the semiconductor laser chip 100. Then, the heat sink 200 mounted with the semiconductor laser chip 100 is adhered to the stem 300 by a low melting point curable metal adhesive 600 (adhesion layer 610). <P>COPYRIGHT: (C)2012,JPO&INPIT |
