SEMICONDUCTOR DEVICE

摘要

One semiconductor device includes a wiring board, a semiconductor chip, and an encapsulation body. The wiring board includes an insulating base, a conductive pattern that is formed on one surface of the insulating base, and a heat dissipation via that is connected to the conductive pattern. The heat dissipation via is provided so as to penetrate through the insulating base from one surface to the other surface, while being exposed from the lateral side of the insulating base. The semiconductor chip is mounted on the wiring board so as to overlap the conductive pattern. The encapsulation body is formed on the wiring board so as to cover the semiconductor chip.

主权项

1. A semiconductor device comprising:
a wiring board including an insulating substrate, a conductive pattern formed on a first surface of the insulating substrate, and heat-radiating vias which are connected to the conductive pattern and are provided in such a way as to be exposed at the sides of the insulating substrate while also passing through the insulating substrate from the first surface to a second surface thereof; a semiconductor chip which is mounted on the wiring board in such a way as to lie over the conductive pattern; and a sealing material which is formed on the insulating substrate in such a way as to cover the semiconductor chip.