| 发明名称 |
MULTILAYER WIRING SUBSTRATE |
| 摘要 |
In one embodiment of the present invention, a multilayer wiring substrate includes: a first wiring substrate having a first core member made of metal with cavities therein; a second wiring substrate having a second core member made of metal; and a bonding layer between the first wiring substrate and the second wiring substrate to bond a top surface of the first wiring substrate to a bottom surface of the second wiring substrate, the bonding layer having a patterned conductive layer. |
| 申请公布号 |
US2016066417(A1) |
申请公布日期 |
2016.03.03 |
| 申请号 |
US201514841278 |
申请日期 |
2015.08.31 |
| 申请人 |
TAIYO YUDEN CO., LTD. |
发明人 |
SUGIYAMA Yuichi;MIYAZAKI Masashi |
| 分类号 |
H05K1/02;H05K1/11;H05K1/03;H05K1/18 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A multilayer wiring substrate, comprising:
a first wiring substrate having a first core member made of metal with cavities therein; a second wiring substrate having a second core member made of metal; and a bonding layer between the first wiring substrate and the second wiring substrate to bond a top surface of the first wiring substrate to a bottom surface of the second wiring substrate, the bonding layer having a patterned conductive layer. |
| 地址 |
Tokyo JP |
