Method And Device For The Production Of Wafers With A Pre-Defined Break Initiation Point

摘要

The present invention relates to a method for the production of layers of solid material (5), in particular for use as wafers. The method preferably comprises the following steps:;providing a workpiece (4) for the separation of the layers of solid material (5), the workpiece (4) having at least one exposed surface, producing and/or providing a carrier unit for receiving at least one layer of solid material (5), the carrier unit having a receiving layer (2) for holding the layer of solid material (5), attaching the receiving layer (2) to the exposed surface of the workpiece (4), thus forming a composite structure, producing a break initiation point (44) by means of pre-defined local stress induction in the peripheral region, in particular at the edge, of the workpiece (4), and separating the layer of solid material (5) from the workpiece (4) starting from the break initiation point (44).

主权项

1. A method for the production of layers of solid material (5), in particular for use as wafers, comprising the following steps:
providing a workpiece (4) for the separation of the layers of solid material (5),
the workpiece (4) having at least one exposed surface, producing and/or providing a carrier unit for receiving at least one layer of solid material (5),
the carrier unit having a receiving layer (2) for holding the layer of solid material (5), attaching the receiving layer (2) to the exposed surface of the workpiece (4), thus forming a composite structure, producing a break initiation point (44) by means of pre-defined local stress induction in the peripheral region, in particular at the edge, of the workpiece (4), and separating the layer of solid material (5) from the workpiece (4) starting from the break initiation point (44).