| 发明名称 |
SEMICONDUCTOR AND OPTOELECTRONIC METHODS and DEVICES |
| 摘要 |
A method for processing a semiconductor wafer, the method including: providing a semiconductor wafer including an image sensor pixels layer including a plurality of image sensor pixels, the layer overlaying a wafer substrate; and then bonding the semiconductor wafer to a carrier wafer; and then cutting off a substantial portion of the wafer substrate, and then processing the substantial portion of the wafer substrate for reuse. |
| 申请公布号 |
US2016064439(A1) |
申请公布日期 |
2016.03.03 |
| 申请号 |
US201514936657 |
申请日期 |
2015.11.09 |
| 申请人 |
Monolithic 3D Inc. |
发明人 |
Or-Bach Zvi;Sekar Deepak C. |
| 分类号 |
H01L27/146 |
主分类号 |
H01L27/146 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for processing a semiconductor wafer, the method comprising:
providing a semiconductor wafer comprising an image sensor pixels layer comprising a plurality of image sensor pixels, said layer overlaying a wafer substrate; and then bonding said semiconductor wafer to a carrier wafer; and then cutting off a substantial portion of said wafer substrate, and then processing said substantial portion of said wafer substrate for reuse. |
| 地址 |
San Jose CA US |
