发明名称 STABILIZATION OF POLYAMIDE WITH COPPER-BASED METAL ORGANIC FRAMEWORKS
摘要 The invention relates to a method for manufacturing of a stabilized polyamide-containing composition, which contains at least 20% by weight of polyamide, which comprises the steps of incorporating of a metal organic framework, which is a copper-based metal organic framework comprising metal ions, which are copper(II)-ions, and a C6-C24 aromatic hydrocarbon, which is substituted with at least two carboxylate groups, wherein two of the at least two carboxylate groups are forming coordinative bonds to the metal ions, into a polyamide-containing composition, which contains at least 20% by weight of polyamide, to obtain a mixture for molding, which contains at least 20% by weight of polyamide; and heating of the obtained mixture for molding comprising the polyamide-containing composition and the metal organic framework to a temperature between 170° C. and 380° C.
申请公布号 US2016060434(A1) 申请公布日期 2016.03.03
申请号 US201414783531 申请日期 2014.04.07
申请人 BASF SE 发明人 REINICKER Roger;MAURER Stefan;MUELLER Ulrich
分类号 C08K5/56 主分类号 C08K5/56
代理机构 代理人
主权项 1. A method for manufacturing a stabilized polyamide-containing composition comprising at least 20% by weight of a polyamide the method comprising: incorporating a metal organic framework into a polyamide-containing composition to obtain a mixture; and heating the mixture to a temperature between 170° C. and 380° C.; wherein: the metal organic framework is a copper-based metal organic framework comprising copper(II)-ions and a C6-C24 aromatic hydrocarbon substituted with at least two carboxylate groups where two of the at least two carboxylate groups form coordinative bonds to the copper(II)-ions, the polyamide-containing composition comprises at least 20% by weight of the polyamide and the mixture comprises at least 20% by weight of the polyamide.
地址 Ludwigshafen DE