AN ETCHING METHOD OF ELECTRIC CONDUCTING FILM OF FLEXIBLE SUBSTRATE USING PLASMA

摘要

According to the present invention, provided is a plasma wide electric conductive film etching method comprising: (a) a step of preparing a coated substrate on the upper surface through an electric conductive film; and (b) a step of irradiating a plasma-inducing energy source on the substrate with an irradiation angle of either 5 to 85 degrees or negative 85 to 5 degrees, vertical to the upper surface of the substrate.