发明名称 |
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME |
摘要 |
A semiconductor device of the present invention includes: a first substrate (1) on which a power semiconductor element (2) is mounted; a heat-dissipating plate (12); an insulating layer (11) disposed between the first substrate (1) and the heat-dissipating plate (12); and molding resin (4) that molds the first substrate (1), the heat-dissipating plate (12), and the insulating layer (11). The heat-dissipating plate (12) has a first surface opposite to the insulating layer (12), the first surface being exposed from the molding resin (4). The insulating layer (11) has a curved area (11a) that is curved to the first surface and an end that is located in the molding resin (4). |
申请公布号 |
EP2955748(A4) |
申请公布日期 |
2016.02.24 |
申请号 |
EP20140748506 |
申请日期 |
2014.02.03 |
申请人 |
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
发明人 |
TANAKA, ZYUNYA |
分类号 |
H01L23/36;H01L25/07;H01L25/18 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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