发明名称 |
Apparatus for controlling the temperature uniformity of a substrate |
摘要 |
Apparatus for controlling the thermal uniformity of a substrate. In some embodiments, the thermal uniformity of the substrate is controlled to be more uniform. In some embodiments, the thermal uniformity of the substrate is controlled to be non-uniform in a desired pattern. In some embodiments, an apparatus for controlling thermal uniformity of a substrate includes a substrate support having a support surface to support a substrate thereon. A plurality of flow paths having a substantially equivalent fluid conductance are disposed within the substrate support to flow a heat transfer fluid beneath the support surface. |
申请公布号 |
US9267742(B2) |
申请公布日期 |
2016.02.23 |
申请号 |
US201012886255 |
申请日期 |
2010.09.20 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
Bera Kallol;Zhou Xiaoping;Buchberger, Jr. Douglas A.;Nguyen Andrew;Tavassoli Hamid;Kumar Surajit;Rauf Shahid |
分类号 |
F25B29/00;F28F3/12;F28F13/00 |
主分类号 |
F25B29/00 |
代理机构 |
Moser Taboada |
代理人 |
Moser Taboada ;Taboada Alan |
主权项 |
1. An apparatus for controlling the thermal uniformity of a substrate, comprising:
a substrate support having a support surface to support a substrate thereon; and a plurality of flow paths having a substantially equivalent fluid conductance disposed within the substrate support to flow a heat transfer fluid beneath the support surface, wherein each of the plurality of flow paths winds radially inwardly in a reciprocating manner toward a center of the substrate support in a first direction, and, prior to reaching the center, subsequently winds radially outwardly in a reciprocating manner toward a periphery of the substrate support in a second direction different than the first direction. |
地址 |
Santa Clara CA US |