发明名称 Apparatus for controlling the temperature uniformity of a substrate
摘要 Apparatus for controlling the thermal uniformity of a substrate. In some embodiments, the thermal uniformity of the substrate is controlled to be more uniform. In some embodiments, the thermal uniformity of the substrate is controlled to be non-uniform in a desired pattern. In some embodiments, an apparatus for controlling thermal uniformity of a substrate includes a substrate support having a support surface to support a substrate thereon. A plurality of flow paths having a substantially equivalent fluid conductance are disposed within the substrate support to flow a heat transfer fluid beneath the support surface.
申请公布号 US9267742(B2) 申请公布日期 2016.02.23
申请号 US201012886255 申请日期 2010.09.20
申请人 APPLIED MATERIALS, INC. 发明人 Bera Kallol;Zhou Xiaoping;Buchberger, Jr. Douglas A.;Nguyen Andrew;Tavassoli Hamid;Kumar Surajit;Rauf Shahid
分类号 F25B29/00;F28F3/12;F28F13/00 主分类号 F25B29/00
代理机构 Moser Taboada 代理人 Moser Taboada ;Taboada Alan
主权项 1. An apparatus for controlling the thermal uniformity of a substrate, comprising: a substrate support having a support surface to support a substrate thereon; and a plurality of flow paths having a substantially equivalent fluid conductance disposed within the substrate support to flow a heat transfer fluid beneath the support surface, wherein each of the plurality of flow paths winds radially inwardly in a reciprocating manner toward a center of the substrate support in a first direction, and, prior to reaching the center, subsequently winds radially outwardly in a reciprocating manner toward a periphery of the substrate support in a second direction different than the first direction.
地址 Santa Clara CA US