| 摘要 |
A substrate joining method, according to the present invention, is described as follows. A wafer is supported by a support table arranged inside a lower housing from a pair of housings for forming a chamber. A support plate is supported by a pressure member arranged inside an upper housing to allow the wafer and the support plate to face each other. A double-sided tape having a larger size than the outer shape of the housing is attached to a joint part of the lower housing. When the upper and lower housings are bonded to each other by the double-sided tape, the double-sided tape is attached while allowing the pressure of any one space where the wafer and the support plate are arranged to be adjacent to the adhesive surface of the double-sided tape to be lower than the pressure of another space. After then, the support plate is attached to the double-sided tape by allowing the pressure member to descend. The double-sided tape is cut along the outer shape of the support plate by opening the chamber. |
