| 摘要 |
A MEMS transducer package 300 having a first integrated circuit die 200 which has an integrated MEMS transducer 202 (eg a microphone) and integrated analogue electronic circuitry 203 for operation of the MEMS transducer. The package is arranged such that the footprint of the MEMS transducer package is substantially the same size as the footprint of the integrated circuit die. At least part of the first integrated circuit die 200 may form a sidewall of the package. The package may be formed by a first package cover 302 which overlies the MEMS transducer and a second package cover 301 on the other side of the first integrated circuit die. A second digital integrated circuit may be arranged in the package for processing data from the MEMS transducer die. The MEMS die may have bond pads formed at one end of the die (see figure 4b). The MEMS die may also comprise metallic vias and layers for EMI shielding (see figures 10a & 10b). A die attach film (DAF) may be used to seal the lower cavity of the MEMS transducer. |
