CONSTRUCTION METHOD USING A SEMICONDUCTOR FAB MODULAR DESIGN UTILITIES

摘要

The present invention relates to a construction method using semiconductor fab utility modularization design and, more specifically, to a construction method using semiconductor fab utility modularization design which minimizes a construction period delay risk due to a design change by flexibly coping with a frequent change of equipment, enables efficient construction through semiconductor fab utility modularization such as construction manpower and time reduction and the like, primarily performs a piping work in advance through a semiconductor fab utility module to minimize a lifting work of a pipe or the like and a site pipe welding process during construction so as to drastically shorten a construction period, reduces lifting management input manpower, obtains uniform quality, and expects a reduction effect of initial investment money.