SUPPORT MEMBER, WIRING SUBSTRATE, METHOD FOR MANUFACTURING WIRING SUBSTRATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

摘要

A wiring substrate comprises a support member and a wiring member which is formed on one side of the support member. The support member comprises metal foils and at least one resin layer alternately stacked so that one of the metal foils is installed on the one side of the support member as a first outermost layer and another one of the metal foils is installed on another side of the support member as a second outermost layer. The first outermost layer comprises thick and thin foils to which are peelably adhered. The thick foil comes in contact with the at least one resin layer. One surface of the thin foil faces one side of the support member. The wiring member comprises wiring layers and an insulating layer alternately stacked on the thin foil. The number of the metal foils and the number of the wiring layers are the same.