SEMICONDUCTOR DEVICE WITH AN ISOLATION STRUCTURE COUPLED TO A COVER OF THE SEMICONDUCTOR DEVICE

摘要

A system and method for packaging a semiconductor device that includes a structure to reduce electromagnetic coupling are presented. The semiconductor device is formed on a substrate. A cover is affixed to the substrate so as to extend over the semiconductor device. An isolation structure of electrically conductive material is coupled to the cover in between components of the semiconductor device, with the isolation structure being configured to reduce inductive coupling between those components during an operation of the semiconductor device. In one version, the isolation structure includes a first leg extending from a ground connection along a side wall of the cover to a cross member contiguous with a primary cover wall that extends over the semiconductor device between the components to be isolated electromagnetically.

主权项

1. A semiconductor device comprising:
a substrate having a surface; an electronic device formed on the substrate and comprising a first electrical component and a second electrical component; a cover fabricated separate from and adhered to the substrate so as to extend over the first electrical component and the second electrical component, the cover including first and second side walls between which a primary wall extends; and an isolation structure including:
a first cross member contiguous with the cover and extending over the surface of the substrate in between the first electrical component and the second electrical component, the first cross member being formed on the primary wall, anda first leg located on the first side wall, wherein the first leg is electrically connected to the first cross member, wherein the isolation structure is configured to reduce electromagnetic coupling between the first electrical component and the second electrical component during an operation of the electronic device.