发明名称 SEMICONDUCTOR DEVICE, POWER MODULE, ELECTRIC POWER CONVERTING DEVICE, AUTOMOBILE, AND RAILWAY VEHICLE
摘要 The invention prevents a decrease in breakdown voltage attributable to an accumulation of electric charge in a termination region of a SiC element, and achieves a reduction in the size of the SiC element terminating structure. As means therefor there are provided, in the vicinity of a boundary between an active region and the termination region of a semiconductor chip: a MOS structure; a channel region below said MOS structure; and a diffusion region which is adjacent to the channel region and is electrically connected to a source electrode. In the semiconductor chip, a gate electrode which is a constituent of the MOS structure is turned on, and electrons are supplied to the diffusion region and the channel region, thereby eliminating holes that have accumulated in the substrate in the termination region.
申请公布号 WO2016021077(A1) 申请公布日期 2016.02.11
申请号 WO2014JP71119 申请日期 2014.08.08
申请人 HITACHI, LTD. 发明人 TEGA, NAOKI;HISAMOTO, DIGH;KOBAYASHI, KEISUKE
分类号 H01L29/78;H01L29/06 主分类号 H01L29/78
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