Electronic devices utilizing contact pads with protrusions and methods for fabrication

摘要

An electronic device includes a substrate including a front side, a back side, a thickness between the front side and back side, one or more front-side vias extending from the front side into a part of the thickness, and an interconnect via extending from the back side toward the front side; a contact pad on the front side and including one or more protrusions extending through corresponding front-side vias and into the interconnect via; and an interconnect extending through the interconnect via and into contact with the protrusion(s).

主权项

1. A method for fabricating an electronic device, the method comprising:
forming a front-side via in a substrate, the substrate comprising a front side, a back side and a thickness between the front side and the back side, wherein the front-side via extends from the front side into a part of the thickness; forming a contact pad comprising a protrusion, by depositing a contact pad material on the front side such that the contact pad material fills the front-side via; forming an interconnect via by etching the substrate from the back side until exposing the protrusion in the interconnect via; and forming an interconnect in contact with the contact pad by depositing an interconnect material in the interconnect via such that the interconnect material is at least conformally disposed on a portion of the back side surrounding the interconnect via, on a wall of the substrate circumscribing a cross-section of the interconnect via, and on the protrusion.