| 摘要 |
PROBLEM TO BE SOLVED: To provide a polisher which can improve the polishing rate of silicon nitride and reduce the polishing rate of silicon oxide.SOLUTION: A polisher comprises a liquid medium, an abrasive grain comprising hydroxide of a tetravalent metal element, a nonionic compound, and a cationic compound with a structure represented by formula (I), where R-Rindependently represent H or a C1-10 alkyl group; n is an integer of 2 or more; and Z is an anion.SELECTED DRAWING: None |
