| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board that prevents electrical short circuit between solder bumps when a semiconductor element is mounted via the solder bump.SOLUTION: A wiring board 100 is formed by laminating a prepreg with an open hole 1V filled with a conductor paste and a core wiring conductor 2 alternately and plurally and forming a core substrate 3 where the prepreg and the conductor paste are heated and hardened, and forming a buildup part 6 where a buildup insulator layer 4 and a buildup wiring conductor 5 are alternately laminated on upper and lower surfaces of the core substrate 3. The wiring board 100 has a loading part 100A where a semiconductor element S is loaded on an upper surface center of the buildup part 6. The formation density of the open hole 1V at a center area of the core substrate 3 corresponding to the loading part 100A is higher than that at an outer area. The open hole 1V is formed with a high density up to an outer area of the loading part 100A in plan view.SELECTED DRAWING: Figure 1 |
