| 发明名称 |
Housing and Method for Producing a Housing |
| 摘要 |
A housing for an optoelectronic semiconductor component includes a housing body having a mounting plane and a leadframe with a first connection conductor and a second connection conductor. The housing body deforms the leadframe in some regions. The leadframe has a main extension plane which extends obliquely or perpendicularly with respect to the mounting plane. A semiconductor component having such a housing and a semiconductor chip and a method for producing a housing are also disclosed. |
| 申请公布号 |
US2016036198(A1) |
申请公布日期 |
2016.02.04 |
| 申请号 |
US201514884500 |
申请日期 |
2015.10.15 |
| 申请人 |
OSRAM Opto Semiconductors GmbH |
发明人 |
Strauss Uwe;Arzberger Markus |
| 分类号 |
H01S5/022;H05K5/00 |
主分类号 |
H01S5/022 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A housing for an optoelectronic semiconductor component, the housing comprising:
a housing body having a mounting plane and a leadframe having a first connection conductor and a second connection conductor, wherein the housing body molds around the leadframe in regions, wherein the leadframe has a main extension plane running obliquely or perpendicularly with respect to the mounting plane, and wherein the main extension plane of the leadframe is embodied completely in planar fashion. |
| 地址 |
Regensburg DE |
