EPOXY RESIN COMPOSITION, CURED PRODUCT, FIBER-REINFORCED COMPOSITE MATERIAL, FIBER-REINFORCED RESIN MOLDING, SEMICONDUCTOR SEALING MATERIAL, SEMICONDUCTOR DEVICE, PREPREG, CIRCUIT BOARD, BUILD-UP FILM, AND BUILD-UP SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin composition from which a cured product is obtained which can express excellent flame retardancy as well as excellent flexural strength, elastic modulus, and flexural strain, and provide a fiber-reinforced resin molding, a prepreg, a circuit board, a build-up film, and a build-up substrate all of which are prepared with the composition.SOLUTION: An epoxy resin composition comprises epoxy resin (A), amine curing agent (B), and a phosphorus atom-containing oligomer (C) represented by the following structure formula (1) as essential components.SELECTED DRAWING: None