| 摘要 |
Provided are: an interposer capable of achieving low cost and high-density mounting, and reducing transmission noise, even in the case of a package/substrate incorporating a plurality of LSI circuits such as SiPs; a printed circuit board; and a semiconductor device. An interposer inserted between a plurality of semiconductor LSI circuits is characterized by having: a terminal structure incorporating a capacitor and comprising a power-source terminal, a GND terminal, and a signal terminal; and a noise filter structure for suppressing noise transmission between the plurality of semiconductor LSI circuits. |
