| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a mounting substrate capable of achieving high yield and productivity.SOLUTION: A method for manufacturing a mounting substrate comprises the steps of: forming a mounting electrode part on a first surface of an unwound resin substrate; sticking the resin substrate in which the mounting electrode part is formed to a support member (bonding step); and mounting a light-emitting component onto the mounting electrode part on the resin substrate stuck to the support member. When the thickness of the support member is T1, the thickness of an adhesion layer is T2, and the thickness of the resin substrate is T3, the relationship of T1≥T2 and T1≥T3 is established. When a thermal conductivity in a thickness direction of the support member is K1, a thermal conductivity in a thickness direction of the adhesion layer is K2, and a thermal conductivity in a thickness direction of the resin substrate is K3, the relationship of K1≥K2 and K1≥K3 is established.SELECTED DRAWING: Figure 2 |
