发明名称 THERMALLY ENHANCED ELECTRICALLY INSULATIVE ADHESIVE PASTE
摘要 A THERMAL INTERFACE MATERIAL COMPRISES LARGER CONFORMABLE THERMALLY CONDUCTIVE PARTICLES, AND SMALLER CERAMIC THERMALLY CONDUCTIVE PARTICLES IN A BINDER. THE BINDER CAN INCLUDE THERMOPLASTIC (AND OPTIONALLY THERMOSET) PARTICLES AND A FUGITIVE LIQUID WHICH ARE SUBSTANTIALLY INSOLUBLE IN EACH OTHER. THE BINDER CAN ALSO INCLUDE A LIQUID EPOXY. EACH OF THE LARGER THERMALLY CONDUCTIVE PARTICLES IS ITSELF A COHESIVE YET CONFORMABLE AGGLOMERATION OF PLATY PARTICLES.
申请公布号 MY156252(A) 申请公布日期 2016.01.29
申请号 MY2010PI04497 申请日期 2009.03.26
申请人 DIEMAT, INC. 发明人 PAWEL CZUBAROW;RAYMOND L.DIETZ;MACIEJ PATELKA
分类号 C09J9/00 主分类号 C09J9/00
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