ADAPTIVE PROCESSES FOR IMPROVING INTEGRITY OF SURFACES

摘要

A process for performing localized corrective actions to structure of an electronic device is described. The structure may include a mating surface configured to receive another structured such that the two structures may be, for example, adhesively bonded together. The localized corrective actions are configured not to improve the mating surface but to also prevent light within the electronic device from escaping in undesired areas of the electronic device. In some embodiments, the corrective action includes using a removal tool to remove identified portions of the surface. In other embodiments, the corrective action includes using a different tool to add material identified portions of the surface. The identified means may include an automated inspection system.

主权项

1. A method for assembling a first part of an electronic device with a second part of the electronic device, the method comprising:
scanning the first part to determine a first surface profile; scanning the second part to determine a second surface profile; receiving a material on the second part, based upon the first surface profile and the second surface profile, the material allowing the first part to be positioned on the material such that the first part is co-planar with the respect to the second part; and securing the first part with the material.