Stackable package by using internal stacking modules

摘要

A semiconductor package comprises a substrate, a first semiconductor die mounted to the substrate, and a first double side mold (DSM) internal stackable module (ISM) bonded directly to the first semiconductor die through a first adhesive. The first DSM ISM includes a first molding compound, and a second semiconductor die disposed in the first molding compound. The semiconductor package further comprises a first electrical connection coupled between the first semiconductor die and the substrate, and a second electrical connection coupled between the first DSM ISM and the substrate.

主权项

1. A method of making a semiconductor device, comprising:
providing a substrate; disposing a first semiconductor die over the substrate; providing a first double side mold (DSM) internal stackable module (ISM) by,
(a) providing a platform including conductive traces formed in the platform,(b) disposing a second semiconductor die over a first surface of the platform,(c) disposing a third semiconductor die over a second surface of the platform opposite the first surface of the platform, and(d) depositing a first encapsulant over the second semiconductor die and third semiconductor die; disposing the first DSM ISM over the first semiconductor die after depositing the first encapsulant over the first semiconductor die and third semiconductor die forming a first bond wire between the platform and substrate; and depositing a second encapsulant over the first bond wire, substrate, and first DSM ISM including depositing the second encapsulant over the second semiconductor die and third semiconductor die.