| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor tester that can conduct a relatively large DC current without adversely affecting a semiconductor device in testing and can reduce scratches generated on an electrode of the semiconductor device after electric conduction.SOLUTION: A semiconductor device 1 is mounted on a surface of a cooling plate 2 in a manner in which a rear surface contacts the surface of the cooling plate 2, and is provided with a laminate metal foil 20 that is formed by lamination of a plurality of metal foils on a surface of the semiconductor device 1. When pressure treatment by pressure mechanisms such as a pressuring shaft 4 and a pressure plate holding plate 10 is performed, a pressure surface that is a rear surface of a pressure plate 3 presses the semiconductor device 1 from its surface via the laminate metal foil 20, and a DC current is supplied from an electric conduction unit 8 to between the cooling plate 2 and pressure plate 3. |
