PACKAGE MEMS SWITCH AND METHOD

摘要

An electronic device and methods including a switch formed in a chip package are shown. An electronic device and methods including a switch formed in a polymer based dielectric are shown. Examples of switches shown include microelectromechanical system (MEMS) structures, such as cantilever switches and/or shunt switches.

主权项

1. An electronic device, comprising:
a semiconductor chip coupled to a package substrate; at least one switch housed at least partially within the package substrate, the switch including;
a conductive trace;a conductive beam housed within a package substrate dielectric, the conductive beam having at least one end that is exposed within the dielectric and is free to move;wherein the at least one end is spaced apart from a corresponding conductive trace by a gap; a magnetic component configured to provide at least a portion of an actuation force to move the at least one end; and an electrostatic mechanism configured to provide at least a portion of the actuation force to move or hold in place the at least one end adjacent to the conductive trace.