| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer protection film that does not damage or contaminate a wafer and has a high conductivity.SOLUTION: A wafer protection film 1 includes a middle layer comprising synthetic resin and a surface layer formed on its both sides. The surface layer primarily comprises polyethylene resin, has 35-70% crystallinity of the resin component constituting the surface layer, and also comprises carbon black at the rate of 10-30 wt.%. |
