Camera module including image sensor die in molded cavity substrate

摘要

Systems and methods of manufacturing compact camera modules for use in electronic device are provided. These designs may provide small form factor autofocus (AF) camera modules for incorporation into thin mobile devices, such as tablets or smartphones. The camera module includes a flexible tape substrate having an image sensor die wire bonded to an upper side of the substrate and a molded stiffener formed on the lower side of the substrate.

主权项

1. A camera module, comprising:
a substrate assembly having a lower side and an upper side comprising a die attach region and a component mounting region, wherein the component mounting region comprises a plurality of component contacts surrounding the die attach region, said substrate assembly comprising:
a flexible substrate comprising a circuit board contact region and a die mounting opening; anda molded stiffener member forming the lower side of the substrate assembly; an image sensor die coupled to the die attach region of the substrate assembly, said image sensor die comprising a plurality of die contacts wire bonded to the flexible substrate, wherein the image sensor die is positioned in the die mounting opening and bonded to the molded stiffener member; a plurality of electronic components, each of the electronic components being coupled to a respective one of the plurality of component contacts; and a lens module comprising a lens housing and at least one lens contained in the lens housing, said lens housing being coupled to the upper side of the substrate assembly.