发明名称 SUSPENSION SUBSTRATE HAVING CIRCUIT AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a suspension substrate having a circuit capable of improving connection reliability to an electronic element.SOLUTION: A suspension substrate 1 having a circuit includes: a metal support substrate 8; a base insulator layer 9 formed on the metal support substrate 8; a conductor layer 10; and a cover insulator layer 11 formed on the base insulator layer 9 and covering the conductor layer 10. The base insulator layer 9 includes a terminal opening part 49 penetrating the base insulator layer 9 in thickness direction. The conductor layer 10 includes: wiring 35 formed on the base insulator layer 9; a piezo terminal 34 electrically connected to the wiring 35 and exposed from the terminal opening part 49 and electrically connectable to a piezoelectric element 5; and further, a protective layer 50 protecting the piezo terminal 34 exposed from the terminal opening part 49.
申请公布号 JP2016009513(A) 申请公布日期 2016.01.18
申请号 JP20140131590 申请日期 2014.06.26
申请人 NITTO DENKO CORP 发明人 SAKAKURA TAKATOSHI
分类号 G11B5/60;G11B21/21 主分类号 G11B5/60
代理机构 代理人
主权项
地址