| 发明名称 |
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
A method of manufacturing a semiconductor package includes forming a bonding layer on a carrier substrate, bonding an inner substrate to the carrier substrate, removing the carrier substrate, and forming a gap-filling portion by removing a portion of the bonding layer to expose a portion of a solder ball provided in the inner substrate. The inner substrate may be mounted on a package substrate and a semiconductor chip may be mounted on the inner substrate. |
| 申请公布号 |
US2016013091(A1) |
申请公布日期 |
2016.01.14 |
| 申请号 |
US201514723642 |
申请日期 |
2015.05.28 |
| 申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
Kim Ji-hwang;Kang Un-byoung;Jo Cha-jea;Cho Tae-je |
| 分类号 |
H01L21/768;H01L23/498;H01L21/48 |
主分类号 |
H01L21/768 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of manufacturing a semiconductor package, the method comprising:
forming a bonding layer on a carrier substrate; bonding an inner substrate and the carrier substrate with the bonding layer; removing the carrier substrate; forming a gap-filling portion by removing a portion of the bonding layer to expose a portion of a solder ball provided in the inner substrate; and mounting the inner substrate on a package substrate by performing thermocompression bonding. |
| 地址 |
Suwon-si KR |
