| 摘要 |
PURPOSE:To prevent wires from deforming against the resin feeding pressure also from short-circuiting in contact with corners of pellets by a method wherein parts to be molded are fixed to metallic molds making loop parts of wires protrude downward. CONSTITUTION:First, pellets 40 and a lead frame 50 protruded upward are connected with each other in wire bonding process. Then they are carried to molding process to be fixed to cavities 13 of a lower mold 12 as they are protruded downward. Second, the lower mold 12 and an upper mold 13 with the lead frames 50 fixed thereto are mold clamped. A tablet type resin 20 preliminarily heated up to about 70-100 deg.C is fixed to a tablet spot 14 to be pressurized. Then the tablet type resin 20 heat-molten flows into respective cavities 13 through runners 15. At this time, the stability due to deadweight of loop part hanging down applies momemtum thereto in arrow A directions. |
